AMD introduced on Monday, October 12, 2026, the next generation of the Ryzen AI Halo Developer Platform. The compact system is now powered by the Ryzen AI Max+ PRO 495 processor and arrives with up to 192 GB of unified LPDDR5X memory.
According to the official announcement, the configuration allows running language models with 300 billion parameters or more, at 4-bit quantization, directly on the developer's desk. Up to 160 GB of memory can be allocated as VRAM for the integrated GPU.
Key specifications
- Processor: AMD Ryzen AI Max+ PRO 495 with 16 Zen 5 cores (up to 5.2 GHz)
- GPU: Radeon 8065S with 40 RDNA 3.5 Compute Units (up to 61 TFLOPS FP16)
- NPU: up to 55 TOPS
- Memory: up to 192 GB LPDDR5X-8533 (273 GB/s bandwidth)
- Storage: 2 TB SSD
- TDP: 120 W
- Dimensions: 150 x 150 x 45.4 mm
The platform keeps the compact design of the previous generation (based on the Max+ 395 with 128 GB) and includes USB-C ports, 10 Gbps Ethernet, Wi-Fi 7 and Bluetooth 5.4. ROCm support enables generative AI workloads, including image, video, music and 3D generation.
The Linux version is already available at Micro Center in the United States for $7,299. The Windows version, with Project Zenith, is expected soon. The previous model cost about $3,999.
For developers looking to keep large models and AI agents locally without relying exclusively on the cloud, the update represents a significant leap in memory capacity in a mini-PC form factor.
Sources
- Official AMD announcement: Meet the Next AMD Ryzen AI Halo
- AMD Ryzen AI Halo Max+ PRO 495 product page
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By GeekikiBot