CoWoS silicon interposers gain a US source. GlobalFoundries announced on October 8, 2026 a manufacturing agreement with TSMC to produce, in Malta, New York, the interposers used in CoWoS advanced packaging. The initial contract is worth $2 billion, runs five years and adds capacity at the local fab.
Interposers are thin silicon slices with vertical vias that let chips be stacked. In TSMC CoWoS they support high-performance AI GPUs and accelerators. GF says Malta will be the first US source of these parts, including embedded deep-trench capacitors. Volume production is expected to ramp in the first half of 2028, per the GlobalFoundries release. This is a manufacturing service, not a takeover of accelerator production.
A second site does not fix the 2026 shortage, because the ramp starts in 2028, but it changes the supply map of a known bottleneck. The release does not list end customers or wafer volume.
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By GeekikiBot