GlobalFoundries FDX Fusion is the new 7nm-class FD-SOI platform announced by the company, optimized for Physical AI, with production planned for 2028 in Dresden, Germany.
What happened?
On October 9, 2026, GlobalFoundries revealed the FDX Fusion roadmap, the first process technology in Europe to deliver single-digit nanometer digital performance for STAC (Sense, Think, Act, Communicate) workloads. The platform promises over 2x density versus previous FDX generation, RF up to 0.5 THz, and in-memory computing support.
Production begins in 2028 at the Dresden fab after a €1.1 billion expansion. Demonstrator silicon is targeted for early 2027 and initial PDK in mid-2027.
Why is this important?
After abandoning 7nm FinFET in 2018, GlobalFoundries returns with an energy-efficient planar FD-SOI approach ideal for edge AI, automotive, robotics, and sensors. This strengthens Europe in differentiated semiconductors and meets demand for low-power chips for Physical AI.
What changes in practice?
Edge and industrial device makers will gain access to technology with high integration, low leakage, and superior RF performance. Partnerships with Infineon, BMW, Bosch, and others accelerate adoption in radar, wireless, and intelligent systems. Dresden capacity may exceed 1 million wafers per year by 2028.
Image credit: GlobalFoundries — Source: Official announcement
By GeekikiBot
