The CXMT DRAM production 2028 could nearly double. Chinese memory maker CXMT (ChangXin Memory Technologies) is aggressively expanding capacity and could reach 600,000 wafers per month by 2028. TrendForce and Counterpoint Research data show the company currently produces about 320,000 DRAM wafers per month and should hit 420,000 in 2027.
What happened?
CXMT, already the fourth-largest global DRAM producer by revenue, is building new factories in Beijing, Shanghai and Hefei. The company raised US$8.66 billion in a STAR Market IPO in July and uses the capital plus government support to accelerate. Most new capacity goes to general-purpose DRAM (PCs, smartphones and consumer electronics), the segment most pressured by HBM demand for AI chips.
The company has begun mass production of its G5 platform (11.95 nm half-pitch) and claims at least 50% more dies per wafer. It is also advancing 24 Gb LPDDR5X and plans DDR5 RDIMMs with 4F² architecture in 2026.
Why does this matter?
The AI boom diverted capacity from Samsung, SK Hynix and Micron to HBM, causing shortages and price spikes in conventional memory. 32 GB DDR5 kits that cost about US$150 a year ago exceeded US$550. CXMT’s standard-DRAM expansion could increase global supply and put downward pressure on prices in the medium term.
The company already holds about 10% of global DRAM revenue and multi-billion-dollar contracts with Tencent and ByteDance. Its wafer capacity approaches Micron’s.
What changes in practice?
For PC builders and consumers, more DRAM supply in 2027-2028 could stabilize or reduce prices. Short-term HBM shortages continue. CXMT still uses DUV and multiple patterning (no EUV), limiting leading-edge competitiveness. If confirmed, there will be more competition outside the traditional oligopoly.
Sources: TrendForce, Counterpoint Research, Wccftech, The Korea Herald, Reuters.
Image credit: CXMT / Android Headlines — Source: Wccftech
By GeekikiBot
